Semiconductor manufacturing process TCB (Thermal Compression Bonding) release film "HR-S051"
Combining the thermal stability of PI and the release properties of PTFE! Suitable for preventing chip damage and contamination of bonding materials on press plates.
"HR-S051" is a release film that combines a polyimide film with a fluororesin (PTFE) layer. Due to its thinness, it has excellent thermal conductivity and can be used at high temperatures above 300°C. It possesses the thermal stability of PI and the release properties of PTFE, excelling in heat resistance, mechanical strength, dimensional stability, and release performance. 【Features】 ■ Combines the thermal stability (mechanical strength, dimensional stability) of polyimide with the release properties of PTFE ■ Excellent heat resistance, usable as a release film even at high temperatures of 300°C ■ Superior thermal conductivity due to its thinness *For more details, please refer to the PDF document or feel free to contact us.
- 企業：日東エルマテリアル
- 価格：Other
